Zero-force release. No support equipment. Bond and debond in seconds. Designed and manufactured in the United States.
Explore Our Products Contact UsWhy Semi-Bond
Semi-Bond carriers cut process time and equipment cost by eliminating the prep steps, capital equipment, and mechanical handling that conventional bonding methods require.
No capital equipment depreciation — no coaters, bonders, or debonders. A fraction of the cost of electrostatic or adhesive carrier solutions. Ideal for research labs and programs where dedicated bonding tools aren't in the budget.
No spin coat, bake, or cure of bonding material. Carriers arrive ready to use and support tens of bond and debond cycles.
No thermal slide, laser step, or cleaning step. Bond and debond in seconds with zero applied force.
Functional at operational temperatures of 250°C and above, with unlimited submerged bonding capability.
Zero-force bond and debond eliminates mechanical stress on devices. Stronger bonds than leading competitors, with residue-free release.
Works in wet and dry processes including backgrinding and advanced packaging. Compatible with most substrates.
About Semi-Bond
Semi-Bond specializes in designing and manufacturing mobile temporary bonding and debonding carriers for the semiconductor and advanced packaging industries. Our patent pending technology enables zero-force release, wide operational envelopes, and ultra-strong bonds that can hold even the smallest devices.
Research & Government Programs
Semi-Bond carriers require no dedicated bonding or debonding tools — which makes them a straightforward fit for research environments where procuring and qualifying additional capital equipment isn't practical.
University cleanrooms working on thin device fabrication, chip thinning, or 3D integration can use Semi-Bond carriers without adding any new processing tools. Drop into the existing workflow and start working.
All Semi-Bond products are designed and manufactured in the United States. For programs with domestic sourcing requirements — including those funded under CHIPS Act-related initiatives or with defense supply chain constraints — our US manufacturing is a concrete advantage.
Research programs often work with non-standard wafer formats and device geometries that commercial carriers don't support. We work directly with research teams to build carriers that fit their specific substrate sizes and process requirements.