Competitive Total Cost of Ownership
Semi-Bond carriers cost a fraction of competing temporary bonding solutions. No specialized equipment to buy, no lengthy prep steps, and faster cycle times add up quickly.
Mobile Temporary Bonding & Debonding Carriers
Engineered for the semiconductor and advanced packaging industries. Zero-force release. No support equipment. Made in the USA.
Product Overview
Why Choose Semi-Bond Carriers?
Semi-Bond carriers integrate directly into your existing processes with no support equipment required, at a fraction of the cost of electrostatic or adhesive bonding solutions.
Our flagship product, the SBC-LT Series Carrier, is delivered fully prepared for bonding and debonding — no spin coat, bake, or cure of bonding material required. Each carrier supports tens of bond and debond cycles and is functional at operational temperatures of 250°C and above.
No Support Equipment Required
Our carriers drop into your existing semiconductor fabrication and advanced packaging processes. No additional handling equipment or processing tools to procure or qualify.
Fast and Easy Bond & Debond — In Seconds
Bond and debond in seconds. No thermal slide, laser step, or chemical cleaning required.
Multipurpose — Wet and Dry Process Compatible
Semi-Bond carriers work in both wet and dry semiconductor processes, covering a wide range of back-end-of-line and advanced packaging applications.
Zero-Force Bond & Debond
Zero-force bond and debond eliminates mechanical stress on devices and substrates, reducing the risk of damage or breakage throughout the process.
Bond Resilience Across Wide Operational Envelopes
Our carriers maintain bond integrity at operational temperatures of 250°C and above, through wet processes, and under pressure — without bond degradation.
Versatile Substrate Compatibility
Semi-Bond carriers bond to almost any substrate, regardless of material or surface chemistry.
Designed and Manufactured in the United States
All Semi-Bond products are designed and manufactured in the USA, ensuring quality control, supply chain reliability, and domestic sourcing for customers who require it — including government contractors, national laboratories, and organizations operating under CHIPS Act or defense acquisition domestic sourcing requirements.
In Action
Semiconductor & Advanced Packaging Applications
Custom Solutions
Standard and Custom Carrier Configurations
Semi-Bond carriers are available in standard wafer diameters and customer-defined shapes and sizes.
- Standard wafer diameter formats
- Customer-defined shapes and sizes
- Tailored to your specific process requirements
- Engineering support to qualify carriers into your process
- Suitable for university and national lab programs working with non-standard device geometries or research-specific substrate formats
View SBC-LT Carrier Details Request a Custom Quote