Widest Operational Use Cases
- Minimized bonding temperature
- Functional at operational temperatures of 250°C and above
- Unlimited submerged bonding capability
- No applied force required for bonding and debonding
- Stronger bonds than leading competitors
SBC-LT Series Carrier
Zero-force temporary bonding and debonding for semiconductor and advanced packaging. Delivered fully prepared, no capital equipment required.
Product Overview
Mobile Temporary Bonding & Debonding Carrier
The SBC-LT Series Carrier is Semi-Bond's mobile temporary bonding solution for semiconductor backgrinding, advanced packaging, and related processes. Carriers are delivered fully prepared for immediate use — no spin coat, bake, or cure of bonding material required.
Carrier size and shape is customizable to meet customer needs, available in standard wafer diameters as well as customer-defined geometries.
Applications
What the SBC-LT Is Designed For
- Thin wafer handling
- Chip and chiplet handling
- Fragile material and device handling
- Semiconductor and advanced packaging processes
- Adapter carriers for uniform wafer processing sizes
- National laboratory, university, and government-funded advanced packaging and heterogeneous integration research
SBC-LT Bond and Release Procedure
How It Works
The SBC-LT process integrates into existing workflows in five steps, with zero-force bond and debond at every stage.
Step 1
Surface Preparation
Prepare the device surface for bonding
Step 2
Device Bond
Zero-force bond to the SBC-LT carrier
Step 3
Device Processing
e.g. backgrinding, wet/dry processes
Step 4
Processed Device
Device remains securely bonded throughout
Step 5
Device Release
Zero-force release — no thermal, laser, or cleaning step
Key Benefits
Benefits of the SBC-LT Series Carriers
Delivered Fully Prepared
- Carriers arrive ready for bonding and debonding — no preparation needed
- No spin coat, bake, or cure of bonding material
- Maximized reusability: tens of bond and debond cycles per carrier
Simplified Release
- Simplified bond and debond processes reduce production times and delays
- No thermal slide, laser step, or cleaning step required
Lowest Barrier to Entry
- No capital equipment depreciation — no coaters, bonders, or debonders needed
- Lowest upfront and total cost of ownership
- Ideal for low-volume production, R&D programs, and university cleanrooms where dedicated bonding tools aren't available or practical to qualify
- No minimum order volume — works for single-experiment runs as easily as production
Competitive Comparison
SBC-LT vs. Electrostatic & Adhesive Carriers
The SBC-LT Series Carrier outperforms competing temporary bonding technologies across every key metric.
Electrostatic Carrier Limitations
- Rapid bond degradation when submerged, such as when backgrinding
- Bond strength degrades at elevated temperatures, risking device damage and electrostatic discharge events
- Requires ultra-clean, ultra-flat surfaces to function reliably
- Relatively weak bonds make holding small devices like chiplets difficult
- Damaged dielectric layers cause inconsistent performance and latent bond degradation
Adhesive Carrier Limitations
- Adhesive residue left on devices requires cleaning after debonding
- Limited upper operating temperature
- Requires compressive force and high bonding temperatures
- Release mechanisms introduce mechanical or thermal stress to devices
The SBC-LT addresses all of these:
- Rated for 250°C and above with no bond degradation from temperature fluctuations
- Works in submerged environments such as backgrinding and wet thinning processes
- Zero-force bond and debond minimizes device damage risk
- Strong, consistent bonds that reliably hold small devices and chiplets
- Bonds to almost any material, including non-smooth and non-flat surfaces
- No residue or FOD after debonding. No post-process cleaning required
- Rugged construction resistant to the layer damage that degrades electrostatic carriers
- Bonds at lower temperatures than adhesive carriers
| Feature | Semi-Bond Carrier | Electrostatic Carrier | Adhesive Carrier |
|---|---|---|---|
| No Applied Bonding and Debonding Force | ✓ | ✓ | ✗ |
| Functional When Submerged | ✓ | ✗ | ✓ |
| Residue Free | ✓ | ✓ | ✗ |
| Reusability | ✓ | ✓ | ✗ |
| No Capital Equipment Required | ✓ | ✗ | ✗ |
| Total Cost of Ownership | $ | $$ | $$$ |
Product Brochure
SBC-LT Series Carrier Brochure
